Xilinx XC7Z045-1FFG900I
Images are for reference only.
See Product Specifications.
See Product Specifications.
Stock Code 009759
009759
Manufacturer / Brand
Xilinx Part Number XC7Z045-1FFG900I
XC7Z045-1FFG900I
Unit Price $1,588.6100
$1,588.6100
Factory Lead-Time 67 Weeks
67 Weeks
Short Description FPGA with 1.143M Logic Cells, 485k DSP Slices, 53.3Gb/s Transceivers, and 2.5k User I/O
FPGA with 1.143M Logic Cells, 485k DSP Slices, 53.3Gb/s Transceivers, and 2.5k User I/O
Datasheet
In Stock: 175
| Qty | Unit Price | Total Price | Discount |
|---|---|---|---|
| 1 | $1,588.6100 | $1,588.6100 |
Description
The Xilinx XC7Z045-1FFG900I is a System on Chip (SoC) that combines a 32-bit dual-core ARM Cortex-A9 processor with field programmable gate array (FPGA) technology. The FPGA fabric consists of 595,200 logic cells and 4,840 DSP slices, making it ideal for high-performance and high-bandwidth applications. The Cortex-A9 processors operate at a clock speed of up to 1GHz and are equipped with 512KB L2 cache. The SoC also includes memory controllers for DDR3, DDR3L, and DDR2 SDRAM and supports up to 1GB of DDR3 memory.
The XC7Z045-1FFG900I has a range of interfaces including USB, Ethernet, I2C, SPI, UART, CAN, SD/SDIO, and HDMI. This SoC also features advanced security features including AES and SHA hardware accelerators, secure boot, and a physical unclonable function (PUF) for secure key storage. The device is manufactured using a 28nm process technology, which allows for low power consumption, making it an excellent choice for a variety of applications including wireless communication systems, medical equipment, and automotive electronics
The XC7Z045-1FFG900I has a range of interfaces including USB, Ethernet, I2C, SPI, UART, CAN, SD/SDIO, and HDMI. This SoC also features advanced security features including AES and SHA hardware accelerators, secure boot, and a physical unclonable function (PUF) for secure key storage. The device is manufactured using a 28nm process technology, which allows for low power consumption, making it an excellent choice for a variety of applications including wireless communication systems, medical equipment, and automotive electronics
Product Attributes
| Architecture | MCU, FPGA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Number of I/O | 130 |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Packaging | Tray |
| Peripherals | DMA |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| RAM Size | 256KB |
| Speed | 667MHz |
| Supplier Device Package | 900-FCBGA (31x31) |
